pcballinone.com | Professional PCB manufacturing and PCB assembly services - Leading electronic manufacturing services (EMS) provider specializing in custom printed circuit boards, PCB fabrication, PCB production, printed wiring board manufacturing, PWB fabrication, circuit board manufacturing, circuit board assembly, PCBA manufacturing, PCBA assembly, PCBA production, electronic circuit assembly, electronic assembly services, contract manufacturing, turnkey PCB solutions, one-stop PCB services, end-to-end PCB manufacturing, complete PCB solutions, integrated PCB services, full service PCB provider, SMT assembly, SMD assembly, surface mount assembly, surface mount manufacturing, surface mount production, through-hole assembly, THT assembly, mixed technology assembly, hybrid assembly, dual technology assembly, conventional assembly, prototype PCB development, prototype circuit boards, prototype PCBA, prototyping services, concept to production, NPI services, new product introduction, pilot production, pre-production assembly, low volume production, small batch assembly, medium volume production, high volume manufacturing, mass production PCB, volume production assembly, large scale manufacturing, industrial scale production, quick turn PCB fabrication, rapid PCB prototyping, fast track PCB, fast prototype services, express PCB manufacturing, expedited PCB services, rush PCB orders, same day PCB, 24-hour PCB turnaround, 48-hour PCB delivery, emergency PCB services, urgent PCB manufacturing, critical delivery PCB, multilayer PCB boards, multilayer circuit boards, multilayer PWB, complex multilayer assemblies, single layer PCB, single sided PCB, single sided circuit boards, double layer PCB, double sided PCB, two layer PCB, two sided circuit boards, 4-layer PCB, 4-layer circuit boards, 6-layer PCB, 6-layer circuit boards, 8-layer PCB, 8-layer circuit boards, 10-layer PCB, 12-layer PCB, 14-layer PCB, 16-layer PCB, 18-layer PCB, 20-layer PCB, 24-layer PCB, 32-layer PCB, 40+ layer PCB, high layer count PCB, ultra-high layer count boards, complex multilayer boards, advanced multilayer technology, flexible PCB circuits, flex PCB manufacturing, flexible circuit boards, flex circuit assembly, flexible electronics, bendable circuits, foldable PCB, rollable circuits, dynamic flex circuits, rigid-flex PCB technology, rigid-flex circuit boards, rigid-flex manufacturing, rigid-flex assembly, multi-bend flex circuits, 3D flex circuits, sculptured flex, flex-rigid combinations, HDI PCB (High Density Interconnect), HDI circuit boards, HDI manufacturing, HDI assembly, ultra-HDI PCB, advanced HDI technology, microvia PCB, microvia drilling, laser drilling, mechanical drilling, sequential drilling, blind via PCB, buried via PCB, stacked via PCB, staggered via PCB, via-in-pad technology, filled vias, plugged vias, tented vias, sequential lamination, sequential build-up, build-up technology, any-layer HDI, substrate-like PCB, IC substrate manufacturing, RF PCB circuits, RF circuit boards, microwave PCB, microwave circuit boards, mmWave PCB, high frequency PCB, high frequency circuit boards, ultra-high frequency PCB, low loss PCB materials, Rogers PCB, Rogers circuit boards, Taconic PCB, Isola PCB, Nelco PCB, Teflon PCB, PTFE PCB, ceramic-filled PTFE, woven glass PTFE, non-woven PTFE, RT/duroid PCB, TMM PCB, RO4000 series PCB, RO3000 series PCB, low loss tangent PCB, low dielectric constant PCB, ceramic PCB, ceramic circuit boards, alumina PCB, aluminum nitride PCB, LTCC PCB, HTCC PCB, thick film ceramic, thin film ceramic, metal core PCB, MCPCB manufacturing, insulated metal substrate, thermal PCB, aluminum PCB, aluminum backed PCB, aluminum core circuit boards, aluminum clad PCB, copper core PCB, copper backed PCB, copper clad PCB, steel core PCB, thermal management PCB, heat dissipation PCB, thermal interface PCB, LED PCB boards, LED circuit boards, LED strip PCB, LED module PCB, high power LED PCB, COB LED PCB, power electronics PCB, power circuit boards, power module PCB, inverter PCB, converter PCB, motor drive PCB, power supply PCB, switching power supply PCB, linear power supply PCB, battery management PCB, UPS PCB, thick copper PCB, heavy copper PCB, extreme copper PCB, high current PCB, high power PCB, power distribution PCB, bus bar PCB, impedance controlled PCB, controlled impedance boards, differential impedance PCB, single-ended impedance, characteristic impedance, 50 ohm PCB, 75 ohm PCB, 90 ohm PCB, 100 ohm PCB, fine pitch PCB, ultra fine pitch assembly, micro pitch PCB, high density PCB, high density assembly, miniaturized PCB, compact PCB design, space-constrained PCB. 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Surface Mount Technology (SMT) assembly, Surface Mount Device (SMD) placement, surface mount manufacturing, surface mount production, SMT production lines, SMT assembly lines, automated SMT lines, high-speed SMT lines, SMT equipment, SMT machinery, pick and place assembly, pick and place machines, high-speed placement, multi-head placement, chip placement, component mounting, precision placement, vision-guided placement, fiducial alignment, component verification, Ball Grid Array (BGA) assembly, BGA soldering, BGA attachment, BGA rework, BGA reballing, micro BGA assembly, fine pitch BGA, ultra-fine pitch BGA, large BGA assembly, flip chip BGA, plastic BGA (PBGA), ceramic BGA (CBGA), tape BGA (TBGA), Quad Flat Package (QFP) assembly, QFP soldering, fine pitch QFP, ultra-fine pitch QFP, low profile QFP (LQFP), thin QFP (TQFP), very thin QFP (VTQFP), Quad Flat No-lead (QFN) assembly, QFN soldering, dual flat no-lead (DFN), leadless chip carrier (LCC), leadless package assembly, exposed pad QFN, thermal enhanced QFN, wettable flank QFN, Small Outline Package (SOP) assembly, Small Outline Integrated Circuit (SOIC) assembly, narrow SOIC, wide SOIC, Thin Shrink Small Outline Package (TSSOP) assembly, Very Small Outline Package (VSOP) assembly, Shrink Small Outline Package (SSOP) assembly, Thin Small Outline Package (TSOP) assembly, Mini Small Outline Package (MSOP) assembly, Micro Small Outline Package (μSOP) assembly, Plastic Leaded Chip Carrier (PLCC) assembly, ceramic leadless chip carrier (CLCC), Fine Pitch Ball Grid Array (FBGA) assembly, super fine pitch BGA, Chip Scale Package (CSP) assembly, wafer level CSP assembly, flip chip CSP, wire bond CSP, molded CSP, Land Grid Array (LGA) assembly, socket LGA, soldered LGA, Package on Package (PoP) assembly, stacked package assembly, 3D package assembly, through-mold-via (TMV) PoP, System in Package (SiP) assembly, multi-chip module assembly, system on package, heterogeneous integration, chiplet assembly, Micro BGA assembly, extra fine pitch BGA, Ultra Fine Pitch assembly, high density assembly, 0805 component assembly, 0603 component assembly, 0402 component assembly, 0201 component assembly, 01005 component placement, 008004 component mounting, 0080x4 components, ultra-miniature components, passive component assembly, active component assembly, flip chip assembly, flip chip bonding, flip chip attach, direct chip attach (DCA), chip-on-board (COB) assembly, bare die assembly, known good die (KGD) assembly, wire bonding services, thermosonic wire bonding, ultrasonic wire bonding, wedge bonding, ball bonding, gold wire bonding, aluminum wire bonding, copper wire bonding, ribbon bonding, die attach services, die bonding, die placement, adhesive die attach, eutectic die attach, soft solder die attach, silver epoxy die attach, thermal die attach, flip chip die attach, encapsulation services, glob top encapsulation, dam and fill encapsulation, transfer molding, compression molding, injection molding, overmolding, underfill application, capillary underfill, no-flow underfill, molded underfill, corner bond underfill, edge bond underfill, reflow soldering, lead-free reflow, SAC reflow, tin-silver-copper soldering, convection reflow, forced air reflow, IR reflow, infrared reflow, vapor phase soldering, condensation soldering, nitrogen reflow, inert atmosphere reflow, dual-lane reflow, multi-zone reflow, selective soldering, robotic selective soldering, laser soldering, induction soldering, hot bar soldering, pulse heat soldering, thermode soldering, mini wave soldering, fountain selective soldering, dip soldering, drag soldering, iron soldering. Through-hole component assembly, THT assembly, through-hole technology, conventional assembly, axial component insertion, radial component insertion, leaded component assembly, Dual In-line Package (DIP) assembly, DIP socket assembly, Pin Grid Array (PGA) assembly, ceramic PGA assembly, Single In-line Package (SIP) assembly, TO-package assembly, power transistor assembly, connectors assembly, connector soldering, header assembly, socket assembly, terminal blocks assembly, transformers assembly, inductor assembly, toroidal inductor assembly, capacitors assembly, electrolytic capacitor assembly, tantalum capacitor assembly, ceramic capacitor assembly, film capacitor assembly, resistors assembly, carbon resistor assembly, metal film resistor assembly, wire wound resistor assembly, power resistor assembly, precision resistor assembly, crystals assembly, crystal oscillator assembly, ceramic resonator assembly, oscillators assembly, TCXO assembly, VCXO assembly, switches assembly, tactile switch assembly, DIP switch assembly, rotary switch assembly, slide switch assembly, toggle switch assembly, relays assembly, electromagnetic relay assembly, solid state relay assembly, reed relay assembly, fuses assembly, circuit breaker assembly, thermal fuse assembly, PTC resettable fuse assembly, heat sinks installation, thermal pad application, thermal compound application, fan assembly, cooling solution assembly, mechanical component assembly, mounting hardware assembly, standoffs installation, spacers assembly, screws assembly, nuts assembly, washers assembly, brackets assembly, chassis assembly, enclosure assembly, press-fit connector assembly, IDC connector assembly, FFC connector assembly, FPC connector assembly, coaxial connector assembly, RF connector assembly, wave soldering services, dual wave soldering, lead-free wave soldering, selective soldering, robotic selective soldering, mini wave soldering, fountain soldering, dip soldering, hand soldering, manual soldering, iron soldering, hot air soldering, desoldering services, component removal, rework and repair services, PCB rework, BGA rework, component replacement, trace repair, via repair, pad repair, conformal coating removal. Component sourcing and procurement, electronic components supply chain management, obsolete component sourcing, counterfeit component prevention, component engineering, bill of materials (BOM) optimization, design for manufacturing (DFM) analysis, design for assembly (DFA) consultation, design for test (DFT) support, value engineering services, cost reduction analysis, supplier management, vendor qualification, component lifecycle management, end-of-life component management, alternative component sourcing, authorized distributor network, component traceability, component certification. Turnkey PCBA services, consignment assembly, partial turnkey assembly, box build assembly, system integration, final product assembly, enclosure assembly, cable harness manufacturing, wire harness assembly, overmolding services, potting and encapsulation, conformal coating application, underfill application, thermal interface materials, heat sink attachment, mechanical assembly, product testing, burn-in testing, environmental stress screening, accelerated life testing, reliability testing. PCB surface finishes, HASL (Hot Air Solder Leveling), lead-free HASL, ENIG (Electroless Nickel Immersion Gold), ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), OSP (Organic Solderability Preservative), immersion silver, immersion tin, hard gold plating, soft gold plating, selective gold plating, wire bondable gold, contact gold, edge connector gold, carbon ink, peelable solder mask, blue solder mask, white solder mask, clear solder mask, matte solder mask, glossy solder mask, flexible solder mask, photoimageable solder mask, liquid photoimageable solder mask, dry film solder mask, UV-curable solder mask, silkscreen printing, legend printing, component marking, reference designator printing, white silkscreen, yellow silkscreen, black silkscreen, UV-curable ink, epoxy ink, acrylic ink, polyimide ink, PCB drilling, mechanical drilling, laser drilling, CO2 laser drilling, UV laser drilling, plasma drilling, photo via drilling, controlled depth drilling, back drilling, stub removal, aspect ratio drilling, micro drilling, ultra-micro drilling, HDI drilling, blind via drilling, buried via drilling, PCB routing, mechanical routing, laser routing, punch routing, die cutting, precision routing, profile routing, tab routing, breakaway tabs, scoring, V-scoring, V-groove, jump scoring, PCB plating, electroplating, electroless plating, copper plating, through-hole plating, panel plating, pattern plating, pulse plating, additive plating, subtractive plating, semi-additive plating, modified semi-additive process, tent-and-etch, print-and-etch, copper thickness control, plating uniformity, current density control, PCB lamination, multilayer lamination, prepreg lamination, core lamination, sequential lamination, press lamination, vacuum lamination, autoclave lamination, pinless lamination, pin lamination, tooling holes, lamination cycle, glass transition temperature, thermal expansion coefficient, moisture absorption, PCB etching, acid etching, alkaline etching, cupric chloride etching, ferric chloride etching, ammoniacal etching, persulfate etching, spray etching, bubble etching, immersion etching, conveyorized etching, batch etching, etch factor, undercut control, critical dimension control, fine line etching, ultra-fine line capability, PCB cleaning, aqueous cleaning, semi-aqueous cleaning, flux removal, residue removal, ionic contamination removal, cleanliness testing, surface preparation, oxide treatment, micro-etching, roughening, desmear process, plasma desmear, permanganate desmear, chemical desmear, PCB testing and inspection, electrical testing, continuity testing, isolation testing, high voltage testing, capacitance testing, resistance testing, impedance testing, time domain reflectometry (TDR), microsectioning, cross-sectional analysis, thermal cycling, thermal shock testing, moisture sensitivity testing, highly accelerated life testing (HALT), highly accelerated stress screening (HASS), burn-in testing, environmental stress screening (ESS). ISO9001:2015 certified manufacturer, ISO14001 environmental management, ISO45001 occupational health safety, IATF16949 automotive quality, AS9100 aerospace standard, IPC-A-610 workmanship standards, IPC-A-600 PCB acceptance criteria, IPC Class 2 and Class 3 manufacturing, J-STD-001 soldering standards, IPC-7711/7721 rework standards, RoHS compliant manufacturing, REACH compliance, WEEE directive compliance, conflict minerals compliance, UL recognition, CE marking support, FCC compliance support, FDA medical device manufacturing, cGMP compliance, risk management ISO14971. Advanced manufacturing capabilities, Industry 4.0 implementation, smart factory automation, robotic assembly lines, artificial intelligence quality control, machine learning process optimization, digital manufacturing, paperless production, real-time production monitoring, statistical process control, lean manufacturing principles, six sigma quality methodology, continuous improvement programs, traceability systems, MES (Manufacturing Execution System), ERP integration, supply chain visibility, demand forecasting, capacity planning, production scheduling optimization. Fast turnaround services, 24-hour quick turn PCB, express PCB fabrication, same day prototype, expedited assembly services, emergency production support, flexible delivery options, global shipping capabilities, logistics support, supply chain solutions, inventory management, consigned inventory, vendor managed inventory, just-in-time delivery, Kanban systems, demand-driven manufacturing, customer portal access, online ordering systems, real-time project tracking, progress reporting, engineering support, technical consultation, application engineering, field application support, after-sales service, warranty support, long-term partnership programs.

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Haoyue Electronics Co., Ltd.

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Strength One-Stop PCB & PCBA Manufacturer in China

Haoyue Electronics is your trusted partner for precision PCB manufacturing and turnkey PCBA services in China. We help you reduce lead time, simplify sourcing, and boost your business success with reliable, cost-effective solutions.

 

✔️No MOQ for strength PCB & PCBA

 

✔️OEM & ODM Services

 

✔️Complete One-Stop PCB & PCBA Solutions

 

✔️5-Year Warranty with Local Service

 

✔️30+ R&D Engineers

 

✔️100% Original Components

 

✔️No-Reason Refund Guarantee

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PCB Manufacturing
PCB Assembly

Verified

Global Certifications for Excellence

IATF
UL
RoHS
CE
ISO
REACH
Certification

SERVICES

What We Do

All-In-One PCB Services

We specialize in:
PCB Design, PCB Manufacturing, Component Sourcing, PCB Assembly, Enclosure Solutions, and complete All-in-One PCB Services — delivering fast, reliable, and cost-effective solutions from concept to production.

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PCB Factory

Our PCB Manufacturing Factory

Our PCB Manufacturing Factory

Manufacturing

PCB Project

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Rigid PCB

Rigid PCB

Semi-flexible PCB

Semi-Flexible PCB

Flexible PCB

Flexible PCB

Rigid-Flex PCB

Rigid-Flex PCB

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Our PCBA Factory Final Inspection and Packaging Line

PCB Services

All-In-One PCB Services

PCB Manufacturing Capabilities

We offer comprehensive PCB fabrication services, supporting a wide range of materials, structures, and manufacturing complexities:

  • Board Types:

    • HDI PCBs (High-Density Interconnect)

    • Ceramic PCBs

    • Metal Core PCBs (MCPCBs)

    • Special Material PCBs (e.g., Polyimide, PTFE, high-Tg FR4)

    • High-frequency / high-speed PCBs

    • Complex stack-ups with blind/buried vias, impedance control, back-drilling

  • Technical Capabilities:

    • Sample Production Min. Line/Space: 2/2mil

    • Mass Production Min. Line/Space: 2.5/2.5mil (2/2mil available upon request)

    • Layer Count: 1–40 layers

    • Surface Finish Options: HASL, ENIG, OSP, Immersion Tin, Gold Finger

    • Board Types: Rigid, Flexible, Rigid-Flex

  • Quick-turn Prototyping: as fast as 48 hours

PCB Factory
All-In-One PCB Services

Component Sourcing Services

Our dedicated sourcing team ensures fast, reliable, and cost-effective procurement of all electronic components:

  • Expert Team: 35+ experienced sourcing professionals

  • Global Supplier Network: 1,000+ qualified suppliers

  • Inventory Availability: 30,000+ stocked components

  • BOM Services: Fast BOM verification, matching, and substitution support

  • Traceability & Quality: 100% original, RoHS-compliant parts, traceable supply chain

  • Flexible Purchasing Options: Turnkey, consigned, or hybrid models

Electronic Components Warehouse

PCB Assembly Capabilities

We provide high-precision PCB assembly (PCBA) services for prototypes and volume production:

  • Assembly Types: SMT, THT, Mixed Technology

  • Component Sizes Supported: 01005, BGA, CSP, LGA, QFN, Fine Pitch

  • Minimum Pitch: 0.20mm ±0.02mm

  • Assembly Volume: From 1 piece to high-volume batch

  • Turnaround Time:

    • Prototyping: 48 hours

    • Standard production: 3–7 working days

  • Quality Assurance:

    • IQC (Incoming Quality Control)

    • IPQC (In-Process Quality Control)

    • FQC (Final Quality Control)

    • AOI, X-ray, functional testing optional

  • Competitive Pricing: Transparent cost structure and instant online quotation available

PCBA Factory

Wire Harness & Enclosure Services

In addition to PCB and PCBA, we offer integrated mechanical and electrical solutions:

  • Custom Cable & Wire Harness Assembly:

    • Signal, power, data cables

    • Crimping, soldering, testing, and labeling

    • Connector and wire type customization

  • Enclosure & Mechanical Support:

    • Plastic and metal enclosures

    • CNC and injection molding

    • 3D printing for quick prototyping

    • Integration of PCBs, connectors, heatsinks, and other structural elements

  • One-Stop Assembly: Seamless integration with PCB and PCBA processes, saving time and ensuring mechanical-electrical compatibility

PCB All In One
Wire Harness & Enclosure Services

With Haoyue Electronics, your trusted partner for PCB All-in-One services, experience top-tier PCB manufacturing and assembly. We deliver high-quality, authentic components, fast turnaround, and precision craftsmanship – all in one place. From design to delivery, we ensure each project meets the highest industry standards, guaranteeing superior performance and reliability.

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TESTIMONIALS

What People Are Saying

The PCB manufacturing and assembly services provided by Haoyue Electronics were exceptional. The team delivered on time, and the quality of the boards exceeded our expectations. Their attention to detail and rapid turnaround made our product launch a success.

Adeline West

Ich habe mit mehreren PCB-Herstellern gearbeitet, aber keiner hat die Zuverlässigkeit und Expertise von Haoyue Electronics erreicht. Ihre umfassenden Montageservices, kombiniert mit gründlichen Tests, haben dafür gesorgt, dass unsere Produkte alle technischen Spezifikationen erfüllten.

Ada Leonard

Come startup, avevamo bisogno di un produttore di PCB che potesse gestire sia la prototipazione rapida che la produzione di massa. Haoyue Electronics è stata la scelta perfetta: hanno fornito servizi di prototipazione efficienti e produzioni di alta qualità che ci hanno aiutato a crescere rapidamente.

Giovanni Rossi

El equipo de Haoyue Electronics brindó un soporte excepcional tanto en el diseño como en el ensamblaje de nuestros PCBs. Su flexibilidad y compromiso con los estándares de calidad nos permitió producir soluciones innovadoras, manteniendo los costos bajo control. ¡Altamente recomendados para cualquier necesidad de PCB!

Marta Fernández

PCB Fabrication
PCB Assembly

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Trusted PCB Partner from China

  • 100% Genuine Taconic & Rogers PCB Materials
  • Expert in RF, Microwave, and High-Frequency 5G PCB Fabrication
  • Fast Turnaround – Prototypes Ready in 3–5 Business Days
  • Global Delivery with Multilingual Technical Support
  • OEM & ODM Ready – From PCB Design to Full Product Assembly
  • Proven Experience in Aerospace, Medical Devices, and Telecom Applications